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The introduction of a new interlayer material for laminated glass – SentryGlas (SG) – has enabled the development of an innovative glass connection technique in which a metal element is embedded in the interlayer of the laminate and acts as a load-carrying device. At the ILEK tensile tests on the interlayer material were performed to determine the material properties of SG and to develop a numerical material model. Pull-out tests of the proposed metal insert system were carried out to study its load-bearing behaviour under tensile loading. A numerical simulation was performed to model the pull-out tests and to verify the material models developed. This paper focuses on the evaluation of the load transfer behaviour of this connection under short-term tensile loading at various temperatures and the simulated stress distribution within this multi-material system.
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